File Size : 5.33MB ·
1 hits
± Glass passivated or planar junction ± Excellent clamping capability ± Repetition rate (duty cycle): 0.01% ± Low profile package and low inductance ± 400W Peak Pulse power capability at 10×1000μs waveform. ± Fast response time: typically less than 1.0ps from 0V to VBR min. ± High temperature solder.
