TGS2303
Features and Performance
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- Vertical PIN Monolithic Process 0.2-18 GHz Frequency Range 0.5 d B Insertion Loss, Typical 35 d B Isolation, Typical 20 d B Typical Input and Output Return Loss patible with Fully Automated Assembly Series-Shunt-Shunt Configuration
Chip Dimensions 2.16 x 1.65 x 0.1 mm
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Typical Wafer Probe Data
0 -5 -10
Return Loss (d B)
-15 -20 -25 -30 -35 -40 2 4 6 8 10 12 14 16 18 Frequency (GHz)
-0.1 -0.3 -0.5 -0.7 -0.9 -1.1 -1.3 -1.5 2 4 6 8 10 Frequency (GHz) 12 14 16 18
Input Return Loss Output Return Loss
.Data Sheet.net/
Note: Datasheet is subject to change without notice.
Insertion Loss (d B)
Tri Quint Semiconductor Texas : Phone (972)994-8465 Fax (972)994 8504 Web: .triquint.
Datasheet pdf
- http://..co.kr/
Product Data Sheet
Mechanical Drawing
.Data Sheet.net/
Notes: 1. GND is the backside of the MMIC 2. Please refer to the TGS2304-SCC data sheet for the assembly of the TGS2303-SCC MMIC. The primary difference is the TGS2303 has only 3...
