TLFGF1032F Datasheet, Toshiba Semiconductor

max (*) 240°C max Package surface temperature (°C) Temperature profile for Pb-free soldering (example) 5 s max(*) 260°C max Package surface temperature (°C) (*) (*) 4°.

Backlighting for LCDs and switches for automotive applications. Standard embossed tape packing: T14 (4000/reel) 4-mm pi.

TLFGF1032

TLFGF1032T14

TLFGF1060

TLFGF1060T18

TLFGE1002A

TLFGE1008A

TLFGE1100B

TLFGE18TP

TLFGE18TPF

TLFGE19CP

TLFGE19CPF

TLFGE19TP

TLFGE19TPF