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Toshiba Electronic Components Datasheet

CMH01 Datasheet

High Efficiency Rectifier

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CMH01
TOSHIBA High Efficiency Rectifier Silicon Epitaxial Type
CMH01
Switching Mode Power Supply Applications
Repetitive peak reverse voltage: VRRM = 200 V
Average forward current: IF (AV) = 3.0 A
Low forward voltage: VFM=0.98 V (Max) @ IFM = 3.0 A
Very Fast Reverse-Recovery Time: trr =35ns(Max)
Suitable for compact assembly due to small surface-mount package
“MFLATTM” (Toshiba package name)
Absolute Maximum Ratings (Ta = 25°C)
Unit: mm
Characteristics
Symbol
Rating
Unit
Repetitive peak reverse voltage
Average forward current
Peak one cycle surge forward current
(non-repetitive)
VRRM
IF (AV)
IFSM
200
3.0 (Note 1)
40 (50 Hz)
V
A
A
Junction temperature
Storage temperature range
Tj
40 to 150
°C
Tstg
40 to 150
°C
Note 1:
Note2:
T96°C
Device mounted on a ceramic board
board size: 50 mm × 50 mm
soldering land: 2 mm ×2 mm
glass-epoxy board thickness:0.64 mm
JEDEC
JEITA
Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in
TOSHIBA
3-4E1A
temperature, etc.) may cause this product to decrease in the
Weight: 0.023 g (typ.)
reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristics
Peak forward voltage
Peak repetitive reverse current
Reverse recovery time
Forward recovery time
Thermal resistance
(junction to ambient)
Thermal resistance
(junction to lead)
Symbol
VFM (1)
VFM (2)
VFM (3)
IRRM
trr
tfr
Rth (j-a)
Rth (j-)
Test Condition
IFM = 0.1 A (pulse test)
IFM = 1.0 A (pulse test)
IFM = 3.0 A (pulse test)
VRRM = 200 V (pulse test)
IF = 1 A, di/dt = 30 A/μs
IF = 1 A
Device mounted on a ceramic board
(board size: 50 mm × 50 mm)
(soldering land: 2 mm × 2 mm)
(board thickness: 0.64 mm)
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
(soldering land: 6 mm × 6 mm)
(board thickness: 1.6 mm)
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
(soldering land: 2.1 mm × 1.4 mm)
(board thickness: 1.6 mm)
Min Typ. Max Unit
0.64
0.80
V
0.90 0.98
⎯ ⎯ 10 μA
⎯ ⎯ 35 ns
⎯ ⎯ 100 ns
⎯ ⎯ 60
⎯ ⎯ 135 °C/W
⎯ ⎯ 210
⎯ ⎯ 16 °C/W
Start of commercial production
2002-12
1 2013-11-01


Toshiba Electronic Components Datasheet

CMH01 Datasheet

High Efficiency Rectifier

No Preview Available !

Marking
Abbreviation Code
H1
Part No.
CMH01
Standard Soldering Pad
Unit: mm
CMH01
1.4 3.0
1.4
Handling Precaution
The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be exceeded
during operation, even for an instant. The following are the general derating methods that we recommend when you
design a circuit with a device.
VRRM: We recommend that the worst case voltage, including surge voltage, be no greater than 80% of the absolute
maximum rating of VRRM for a DC circuit and be no greater than 50% of that of VRRM for an AC circuit.
VRRM has a temperature coefficient of 0.1%/°C. Take this temperature coefficient into account designing a
device at low temperature.
IF(AV): We recommend that the worst case current be no greater than 80% of the absolute maximum rating of I F(AV).
Carry out adequate heat design. If you can’t design a circuit with excellent heat radiation, set the margin by using
an allowable Tamax-I F(AV) curve.
This rating specifies the non-repetitive peak current in one cycle of a 50-Hz sine wave, condition angle 180. Therefore,
this is only applied for an abnormal operation, which seldom occurs during the lifespan of the device.
We recommend that a device be used at a Tj of below 120°C under the worst load and heat radiation conditions.
Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When using
a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value.
Please refer to the Rectifiers databook for further information.
2 2013-11-01


Part Number CMH01
Description High Efficiency Rectifier
Maker Toshiba Semiconductor
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CMH01 Datasheet PDF






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