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TC190 Datasheet

Manufacturer: Toshiba
TC190 datasheet preview

Datasheet Details

Part number TC190
Datasheet TC190_Toshiba.pdf
File Size 306.60 KB
Manufacturer Toshiba
Description System ASIC
TC190 page 2 TC190 page 3

TC190 Overview

TOSHIBA System ASIC TC190 Series CMOS ASICs 0.6µ 3.0/3.3V ASIC Family The 0.6µm, 5V TC190 ASIC series provides higher system performance and device integration with lower power than previous generation 5V families. Highly accurate delay models, area efficient memory cells and a very fine pitch TAB bonding capability for high I/O requirements are some of the.

TC190 Key Features

  • 707K usable gates up to 730K
  • 14 standard master sizes 21 standard master sizes
  • up to 512 wire bonds Same
  • up to 776 TAB bond pads
  • 62µ Inner lead bond pads Same
  • Typical core power
  • 2.63µW/gate/Mhz
  • 180+ primitive cells Same (scan, standard, high drive cells)
  • 450+ I/O cells including (hign drive Same {24mA} slew rate control high speed output buffers) piled cells
  • sync/async Same single, dual, triple port RAM, ROM
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