MB6S Datasheet | Thinki Semiconductor

Features .275(7)MAX .193(4.9) .177(4.5) ‹ Plastic package has Underwriters Laboratory Flammability Classification 94V-0 ‹ Glass passivated chip junctions ‹ High surge overload rating: 35A peak ‹ Saves space on printed circuit boards ‹ High temperature soldering guaranteed: 260o C/10 seconds. .106(2.7) .090(2.3) .165(4.2) .031(0.8) .019(0.5) .150(3.8) .051(1.3) .067(1.7) .035(0.9) .014(0.35) .006(0.15) Maximum Ratings ‹ Case: Molded plastic body over passivated junctions ‹ Terminals: Plated leads solderable per MIL-STD-750, Method 2026 ‹ Mounting Position: Any ‹ Weight: 0.078 oz., 0.22 g .057(1.3) C .02(.5) .008(.20) .043(1.1) .027(0.7) Maximum Ratings and Electrical Characteristics (TA=25o C unless otherwise noted) Parameter Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward output rectified current (see Fig.1) on glass-epoxy P.C.B. on aluminum substrate Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load (JEDEC Method) Rating for fusing (t < 8.3ms) Maximum instantaneous forward voltage drop per leg at 0.4A Maximum DC reverse current at rated DC blocking voltage per leg Typical thermal resistance per leg Typical junction capacitance per leg at 4.0V, 1.0MHz Operating junction and storage temperature range TA = 25 C TA = 125o C o Symbols VRRM VRMS VDC IF(AV) IFSM I2t VF IR RθJA RθJA RθJL CJ TJ, TSTG .106(2.7) .090(2.3) MB05S MB2S 50 35 50 200 140 200 MB4S MB6S 400 280 400 600 420 600 0.5 0.8 (1) (2) MB8S MB10S MB13S 800 560 800 1000 700 1000 1300 910 1300 Units Volt s Volt s Volts Amp Amps A 2sec Volt u A o 35.0 5.0 1.0 5.0 100 85 70 20 (1) (2) (1) C/W p F o 13 -55 to +150 Notes: 1. On glass epoxy P.C.B. mounted on 0.05 x 0.05" (1.3 x 1.3mm) pads 2. On aluminum substrate P.C.B. with an area of 0.8" x 0.8" (20 x 20mm) mounted on 0.05 x 0.05" (1.3 x 1.3mm) solder pad Page 1/2 © 2006 Thinki Semiconductor Co.,Ltd. http://.thinkisemi./ Free Datasheet...