TSM9433 Datasheet | Taiwan Semiconductor

Features Block Diagram - - Advance Trench Process Technology High Density Cell Design for Ultra Low On-resistance Application - - Load Switch PA Switch Ordering Information Part No. TSM9433CS RL Package SOP-8 Packing 2.5Kpcs / 13” Reel P-Channel MOSFET Absolute Maximum Rating (Ta = 25o C unless otherwise noted) Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Pulsed Drain Current Continuous Source Current (Diode Conduction) Maximum Power Dissipation Operating Junction Temperature Operating Junction and Storage Temperature Range a,b o o Symbol VDS VGS ID IDM IS Limit -20 ±12 -5.4 -20 -2.6 Unit V V A A A W o o Ta = 25 C Ta = 70 C 2.5 1.6 +150 - 55 to +150 TJ TJ, TSTG Thermal Performance Parameter Junction to Case Thermal Resistance Junction to Ambient Thermal Resistance (PCB mounted) Notes: a. Pulse width limited by the Maximum junction temperature b. Surface Mounted on FR4 Board, t ≤ 5 sec. Symbol RӨJC RӨJA Limit 30 50 Unit o...