Description
Multiple manufacturer sources
Defined manufacturer source,
Green compound
PACKAGE OUTLINE DIMENSIONS MELF
SUGGEST PAD LAYOUT
DIM.A B C `
Unit (mm)
Min Max 4.80 5.50 2.25 2.67 0.30 0.60
Unit (inch)
Min Max
0.189 0.089 0.012
0.217 0.105 0.024
DIM.C G X X1 Y
Unit (mm)
Typ.4.80 3.30 1.50 6.30 2.70
Unit (inch)
Typ.0.189 0.130 0.059 0.248 0.106
Document Number: DS_S1412010
Version: F14
Small Signal Product
LL5817 thru LL5819
Taiwan Semiconductor
Notice
Specifications of the produc
Features
- - Plastic package has carries underwriters - Ideal for automated placement - Surge overload rating to 25 Ampers peak - Reliable low cost construction utilizing molded
plastic technique results in in-expensive product - High temperature soldering :
260oC/10 seconds at terminals - Mounting position : Any - Weight : 0.12 g - Packing code with suffix "G" means
Green compound (Halogen free)
MELF.