3.0SMCJ33 Datasheet, Taiwan Semiconductor

For surface mounted application Low profile package Built-in strain relief Glass passivated junction Excellent clamping capability Fast response time: Typically less than.

1. For Bidrectional Use C or CA Suffix for Types 3.0SMCJ5.0 through Types 3.0SMCJ170. 2. Electrical Characteristics Ap.