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OPS665 - LED/Photosensor

General Description

Each LED/Photosensor pair in the series consists of a gallium arsenide infrared emitting diode and a NPN silicon phototransistor, mounted in a T-1 package (OPS665, OPS666, OPS667) or in a matched lateral side-looking plastic package (OPS691, OPS692, OPS693 and OPS698).

Key Features

  • High current transfer ratio.
  • Low-cost plastic package.
  • Lateral side-looking clear plastic package (OPS691, OPS692, OPS693 and OPS698) OPS665 - 667 OPS691 - 693 OPS698.

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OPS665, OPS666, OPS667, OPS691, OPS692, OPS693, OPS698 Features:  High current transfer ratio  Low-cost plastic package  Lateral side-looking clear plastic package (OPS691, OPS692, OPS693 and OPS698) OPS665 - 667 OPS691 - 693 OPS698 Description: Each LED/Photosensor pair in the series consists of a gallium arsenide infrared emitting diode and a NPN silicon phototransistor, mounted in a T-1 package (OPS665, OPS666, OPS667) or in a matched lateral side-looking plastic package (OPS691, OPS692, OPS693 and OPS698). Matched pairs are desirable where the application is unique and the quantity required does not justify assembly tooling costs. If separation between the LED and sensor is greater than two times the specified IC(ON) distance, proper alignment becomes critical.