SB073P200-W-AL Features
* Oxide Passivated Junction Low Forward Voltage 150 º C Junction Operating Low Reverse Leakage Supplied as Wafers Platinum Barrier 1. Solderable Surface Ti/Ni/Ag - Suffix "Ag" 2. Wire Bond Surface Aluminium - Suffix "Al" Anode www.DataSheet4U.com Solderable Surface Ti/Ni/Ag Cathode Cathode Symbol
SB073P200-W-AL, SB073P200-W-AG Datasheet
Datasheet Details
SB073P200-W-AL, SB073P200-W-AG
TRANSYS Electronics Limited
184.23 KB
Schottky barrier diode wafer.
This datasheet PDF includes multiple part numbers: SB073P200-W-AL, SB073P200-W-AG.
Please refer to the document for exact specifications by model.
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SB073P200-W-AL Distributor
