The following content is an automatically extracted verbatim text
from the original manufacturer datasheet and is provided for reference purposes only.
View original datasheet text
MULTI-CHIP TRANSISTORS PNP Silicon
MMDT3906
FEATURES
ULTRA-SMALL SURFACE MOUNT PACKAGE EPITAXIAL PLANAR DIE CONSTRUCTION IDEAL FOR LOW POWER AMPLIFICATION
AND SWITCHING ALSO AVAILABLE IN LEAD FREE VERSION PB FREE PRODUCT ARE AVAILABLE :98.5% SN ABOVE
CAN MEET ROHSENVIRONMENT SUBSTANCE DIRECTIVE REQUEST
MECHANICAL DATA
CASE:SOT-363 TERMINALS:SOLDERABLE PER MIL-STD-202G,
METHOD 208 APPROX. WEIGHT:0.006 GRAM Halogen Free:MMDT3906-H
. CASE:SOT-363
DIMENSIONS IN MILLIMETERS AND (INCHES)
MAXIMUM RATINGS
RATINGS AT 25°C AMBIENT TEMPERATURE UNLESS OTHERWISE SPECIFIED.