Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. Low profile surface mounted application in order to optimize board space. Tiny plastic SMD package. High current capability. Fast switching for high efficiency. High surge current capability. Glass passivated chip junction. Lead-free parts meet RoHS requirments. Mechanical data
Case : Molded plastic, SMA Polarity : Indicated by cathode band Mounting Position : Any Weight : Approximated.
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