MLGxxxxx Datasheet | TDK Corporation

FEATURES - pared to our existing 0603 product, this series has a 30% smaller cubic ratio and 45% smaller effective area, making it the optimal product for fine-pitch circuits. - Guaranteed operating temperature range: - 55 to +125°C - Lead free, lead free soldering, and Ro HS pliant. APPLICATIONS For high-frequency applications including mobile phones, high frequency modules (PA, VCO, FEM etc.), Bluetooth, W-LAN, UWB and tuners. PRODUCT IDENTIFICATION MLG 0402 S 2N2 S T (1) (2) (3) (4) (5) (6) (1) Series name (2) Dimensions Conformity to Ro HS Directive 0.4× 0.2mm(L× W) (3) Material code (4) Inductance value 2N2 12N 2.2n H 12n H .. SHAPES AND DIMENSIONS 0.4±0.02 0.2±0.02 (5) Inductance tolerance 0.08 to 0.14 ±0.3n H ±5% (6) Packaging style 0.2±0.02 Weight: 0.07mg Dimensions in mm Taping (reel) SPECIFICATIONS Operating temperature range Storage temperature range - 55 to +125°C - 55 to +125°C [Unit of products] REMENDED PC BOARD PATTERN 0.18 to 0.22 PACKAGING STYLE AND QUANTITIES Packaging style Taping Dimensions in mm Quantity 20000 pieces/reel 0.15 to 0.2 0.15 to 0.2 0.2 REMENDED SOLDERING CONDITION REFLOW SOLDERING 10s max. 240 to 260˚C 230˚C Natural cooling HANDLING AND PRECAUTIONS - Before soldering, be sure to preheat ponents. The preheating temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150°C. - After mounting ponents onto the printed circuit board, do not apply stress through board bending or...