FV-1043 datasheet, diodes equivalent, TAK Cheong Electronics

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Features and benefits

DEVICE MARKING DIAGRAM DO-35 Package (JEDEC) Through-Hole Device Type Mounting Hermetically Sealed Glass Compression Bonded Construction All external sur.

Description

Standard Width Tape Spacing (B) Component Pitch (C) Untaped Lead (L1
– L2) Glass Offset (F) Bent (D) Tape Width (G) Tape Mismatch (E) Taped Lead (G) Lead Beyond Tape (H) 52 52 ± 0.69 5.08 ± 0.4 ± 0.69 ± 0.69 1.2 Max Millimeters 26 26.

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