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FBMH2012HM331-T - Chip Bead Inductors

Key Features

  • Item Summary 330Ω, 1.8 A, 0805/2012 (EIA/JIS) Lifecycle Stage Mass Production Standard packaging quantity (minimum) Taping paper 4000pcs Products characteristics table Impedance Z Measuring Frequency Case Size (EIA/JIS) Rated Current (max) DC Resistance (max) Operating Temp. Range RoHS Compliance (10 subst. ) REACH Compliance (191 subst. ) Halogen Free Soldering 330 Ω ± 25 % 100 MHz 0805/2012 1.8 A 80 mΩ -40 to +125 ℃ (Including-self-generated heat) Yes Yes Yes Reflow/Wave External Dimensions.

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Datasheet Details

Part number FBMH2012HM331-T
Manufacturer TAIYO YUDEN
File Size 260.92 KB
Description Chip Bead Inductors
Datasheet download datasheet FBMH2012HM331-T Datasheet

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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Spec Sheet Chip Bead Inductors for Power Lines (FB series M type)[FBMH] FBMH2012HM331-T Features Item Summary 330Ω, 1.8 A, 0805/2012 (EIA/JIS) Lifecycle Stage Mass Production Standard packaging quantity (minimum) Taping paper 4000pcs Products characteristics table Impedance Z Measuring Frequency Case Size (EIA/JIS) Rated Current (max) DC Resistance (max) Operating Temp. Range RoHS Compliance (10 subst.) REACH Compliance (191 subst.) Halogen Free Soldering 330 Ω ± 25 % 100 MHz 0805/2012 1.8 A 80 mΩ -40 to +125 ℃ (Including-self-generated heat) Yes Yes Yes Reflow/Wave External Dimensions Dimension L 2.0 ±0.2 mm Dimension W 1.25 ±0.2 mm Dimension T 0.85 ±0.2 mm Dimension e 0.5 ±0.3 mm The data is reference only.