* Planar Die Construction
* 500mW Power Dissipation
* Very Sharp Reverse Characteristic
* Very High Stability www.DataSheet4U.com
* Low Reverse Curren.

Power Dissipation at Ta=25° C Forward Voltage Thermal Resistance Junction to Ambient Junction Temperature Storage Temperature Range Value 500 1.5 0.3 175 -65 to +175 Unit mW V K/mW °C °C Conditions PD VF RthJA TJ TSTG IF=200mA Note: Valid provided.

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