* For surface mounted applications in order to optimize board space
* Low profile package
* Built-in strain relief
* Typical maximum temperature coeffic.

in order to optimize board space
* Low profile package
* Built-in strain relief
* Typical maximum temperatu.

Peak Pulse Power Dissipation at TA=25° C by 10x1000µs waveform Power Dissipation on Infinite Heat Sink at TL=50° C Peak Pulse Current at TA=25° C by 10x1000µs waveform Typical Thermal Resistance Junction to Lead Typical Thermal Resistance Junction to.

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