RNCP Series
High Power Anti-Sulfur Thin Film Chip Resistor
Stackpole Electronics, Inc.
Resistive Product Solutions
Test Item
Temperature Cycling
Moisture Resistance
Biased Humidity
Operational Life
Resistance to Soldering
Heat
Solderability
Board Flex (Bending)
Terminal Strength (SMD)
Performance Characteristics (cont.)
Reference Standard
JESD22
Method JA-104
MIL-STD-202
Method 106
MIL-STD-202
Method 103
MIL-STD-202
Method 108
MIL-STD-202
Method 210
J-STD-002
AEC-Q200-005
AEC-Q200-006
Condition of Test
1000 cycles (-55ºC to +125ºC).
Measurement at 24 ± 2 hours
after test conclusion.
1000 h., T=24 hours/cycle
Notes: Steps 7a & 7b not required.
Unpowered.
1000 hours 85ºC / 85% RH.
Specified conditions: 10% of operating
power. Measurement at 24 ± 2 hours
after test conclusion.
1000 hours TA=125ºC at rated power.
Measurement at 24 ± 2 hours after test
conclusion. Remark: Mounted quantity:
Mounted 2 pieces on 1 PCB.
Condition B: Immerse the specimens in an
eutectic solder at 260 ± 5ºC
for 10 ± 1 seconds.
245 ± 5ºC solder, 2 ± 0.5 s. dwell
Solder: Sn96.5 / Ag3.0 / Cu0.5.
3mm deflection.
Pressure X kgf a R0.5 pressure rod
for 60 seconds.
0201: NA
0402: 0.5Kg
0805: 1.0Kg
0603: 0.5Kg
1206: 1.8Kg
Test Limits (ΔR)
F: ± (0.5% + 0.05Ω)
J: ± (1% + 0.1Ω)
Remark: R≤10Ω: F/J: ± (1% + 0.1Ω)
F: ± (1% + 0.05Ω)
J: ± (2% + 0.1Ω)
F: ± (3% + 0.1Ω)
J: ± (3% + 0.1Ω)
F: ± (1% + 0.05Ω)
J: ± (3% + 0.1Ω)
F: ± (0.5% + 0.05Ω)
J: ± (1% + 0.1Ω)
>95% area covered with tin
F: ± (0.5% + 0.05Ω)
J: ± (1% + 0.1Ω)
F: ± (0.5% + 0.05Ω)
J: ± (1% + 0.1Ω)
Power Derating Curve:
-55ºC
100
70ºC
80
60
40
20
155ºC
0
-60 0 20 40 60 80 100 120 140 160 180
Ambient Temperature (ºC)
Rev Date: 03/05/2019
This specification may be changed at any time without prior notice
Please confirm technical specifications before you order and/or use.
2
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