HCJ Series
Surface Mount High Current Jumper Chip Resistor
Stackpole Electronics, Inc.
Resistive Product Solutions
Test
Short Time Overload
High Temperature
Exposure
Low Temperature
Storage
Resistance to
Solder Heat
Moisture Load Life
Temperature cycling
Load Life
Mechanical Shock
Test Method
JIS C-5201-1
clause 4.13
JIS C-5201-1
clause 4.23.2
JIS C 5201-1
clause 4.23.4
JIS C-5201-1
clause 4.18
JIS C-5201-1
clause 4.24
JIS C-5201-1
clause 4.19
JIS C-5201-1
clause 4.25
JIS C-5202
clause 6.7
Performance Characteristics
Test Specification
Test Condition
2.5 times of rated current
Rating power duration: 5 seconds
1000 hours at 155 °C ± 2 °C
For size 0402, max. 0.003 Ω
All other sizes, max. 0.0005 Ω
1000 hours at -55 °C ± 2 °C
The part shall be immersed into the flux specified in the
solder bath 260 °C ± 5 °C for 10 ± 1 seconds
Specimens shall be placed in a chamber and subject to
a relative humidity of 90~95% and to a temperature of
40 °C ± 2 °C. Load with rated current 1.5 hours "ON", 0.5
hours "OFF", for the period of 1000 hours.
-55 °C to +155 °C, 100 cycles
Apply rated power at 70 °C ± 2 °C for 1000 hours
with 1.5 hours "ON" and 0.5 hour "OFF"
a = 50G, t = 11 ms, 5 times shock
Span between fulcrums: 90mm
Bend width: 2mm
Substrate Bending
JIS C-5201-1
clause 4.33
Solderability
JIS C-5201-1
clause 4.17
Solder shall cover 95% or more
of the electrode area
245 ± 5 °C for 3 ± 0.5 seconds
Wave Solder Temperature Condition
Preheating
Soldering
Maximum Temperature
Rev Date: 03/01/2019
This specification may be changed at any time without prior notice.
Please confirm technical specifications before you order and/or use.
2
100 °C ~ 130 °C, max. 100 seconds
250 °C ~ 265 °C, max 10 seconds
260 °C ± 5 °C, max 10 seconds
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