1. 4-pin DIP package 2. Double transfer mold package
(Ideal for Flow Soldering) 3. High isolation voltage between input and output
(Viso(rms) : 5kV) 4. High collector-emitter voltage(VCEO : 80V) 5. Current transfer ratio
(CTR : MIN. 50% at IF=5 mA, VCE=5V ,Ta=25℃) 6. RoHS directive compliant
Appl.