PC817X0NSZ0F Overview
Key Specifications
Package: DIP
Mount Type: Through Hole
Pins: 4
Output Type (varies by manufacturer): Phototransistor
Description
PC817XNNSZ0F Series contains an IRED optically coupled to a phototransistor. It is packaged in a 4-pin DIP.
Key Features
- Double transfer mold package (Ideal for Flow Soldering)
- High isolation voltage between input and output (Viso(rms) : 5kV)
- High collector-emitter voltage(VCEO : 80V)
- Current transfer ratio (CTR : MIN. 50% at IF=5 mA, VCE=5V)
- RoHS directive compliant
