PC817X0NIP1B
Description
PC817XxNSZ1B Series contains an IRED optically coupled to a phototransistor. It is packaged in a 4-pin DIP.
Key Features
- 4-pin DIP package
- Double transfer mold package (Ideal for Flow Soldering)
- High isolation voltage between input and output (Viso(rms) : 5kV)
- High collector-emitter voltage(VCEO : 80V)
- Current transfer ratio (CTR : MIN. 50% at IF=5 mA, VCE=5V ,Ta=25℃)
- RoHS directive compliant
