PC817X Photocoupler
1. 4pin DIP package 2. Double transfer mold package (Ideal for Flow Solder-
ing) 3. High collector-emitter voltage (VCEO:80V(*)) 4. Current transfer ratio (CTR : MIN. 50%.
1. I/O isolation for MCUs (Micro Controller Units) 2. Noise suppression in switching circuits 3. Signal transmission bet.
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