Mechanical Characteris tics 4. Max imum Ratings and Electric al Ch aracteristics 5. Rating and characteristic Curves 6. Packing Spec ification PACK AGIN G SPE CIFIC ATIO.

of Box Label 1 /6 SEMITEL ELECTRONICS Co., LTD 1. Package Outline (TO220-AB) UNIT:m m Lead Frame Material : Copper Plating: Pure Tin Plating Plating Thickness : 8µm to 25.4µm 2 /6 2. MARKING SEMITEL ELECTRONICS Co., LTD MUR2020CT 1. Part Name : .

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