SKCD61C060IHD
Key Features
- high current density
- easy paralleling due to a small forward voltage spread
- positive temperature coefficient
- very soft recovery behavior
- small switching losses
- high ruggedness
- compatible to thick wire bonding
- compatible to standard solder processes Dynamic Characteristics Symbol trr trr Qrr Qrr Irrm Irrm Conditions Tj = 25 °C, 150 A, 300 V, 1500 A/µs Tj = 150 °C, 150 A, 300 V, 1500 A/µs Tj = 25 °C, 150 A, 300 V, 1500 A/µs Tj = 150 °C, 150 A, 300 V, 1500 A/µs Tj = 25 °C, 150 A, 300 V, 1500 A/µs Tj = 150 °C, 150 A, 300 V, 1500 A/µs min. typ. max. Unit µs ns µC 22 88 µC A A
