easy paralleling due to a small forward voltage spread.
positive temperature coefficient.
very soft recovery behavior.
small switching losses.
high ruggedness.
compatible to thick wire bonding.
compatible to standard solder processes
Dynamic Characteristics Symbol
trr trr Qrr Qrr Irrm Irrm
Conditions
Tj = 25 °C, 150 A, 300 V, 1500 A/µs Tj = 150 °C, 150 A, 300 V, 1500 A/µs Tj = 25 °C, 150 A, 300 V, 15.