SKCD09C060I3
Overview
- low forward voltage drop combined with a low temperature dependence
- easy paralleling due to a small forward voltage spread
- very soft recovery behavior
- small switching losses
- high ruggedness
- compatible to thick wire bonding
- compatible to all standard solder processes Dynamic Characteristics Symbol trr trr Qrr Qrr Irrm Irrm Conditions Tj = 25 °C, 10 A, 300 V, 200 A/µs Tj = 125 °C, 10 A, 300 V, 200 A/µs Tj = 25 °C, 10 A, 300 V, 200 A/µs Tj = 125 °C, 10 A, 300 V, 200 A/µs Tj = 25 °C, 10 A, 300 V, 200 A/µs Tj = 125 °C, 10 A, 300 V, 200 A/µs min. typ. max. Unit µs ns
- 8 1.2 8 µC µC A A
