SD3960 Features
* 2N3960, 2N3960UB, SD3960F, SQ3960, SQ3960F Mechanical Specifications Metallization Bonding Pad Size Die Thickness Chip Area Top Surface Top Backside Emitter Base Al - 15 kÅ min. Au - 6.5 kÅ nom. 2.7 mils x 2.7 mils 2.7 mils x 2.7 mils 8 mils nominal 16 mils x 16 mils Silox Passivated Electrical
SD3960F_SemicoaSemiconductor.pdf
Datasheet Details
SD3960, SD3960F
Semicoa Semiconductor
154.32 KB
Chip type 2c3960 geometry 0003 polarity npn.
This datasheet PDF includes multiple part numbers: SD3960, SD3960F.
Please refer to the document for exact specifications by model.
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