SDL03 Datasheet (PDF) Download
SeCoS Halbleitertechnologie GmbH
SDL03

Key Features

  • MECHANICAL DATA Case:SOD-323, Molded plastic over passivated junction Terminals:Solderable per MIL-STD-750, Method 2026 Approx. Weight:0.0041 grams Mounting Position:Any C F E REF. A B C Millimeter Min. Max. 2.30 2.70 1.15 1.35 0.80 1.00 REF.
  • E F Millimeter Min. Max. 1.60 1.80 0.25 0.40 0.05 0.25