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GBPC5010 - Single-Phase 50A Glass Passivated Bridge Rectifier

Download the GBPC5010 datasheet PDF. This datasheet also covers the GBPC50005 variant, as both devices belong to the same single-phase 50a glass passivated bridge rectifier family and are provided as variant models within a single manufacturer datasheet.

Features

  • Universal 3-way terminals: snap-on, wire wrap-around, or P. C. B. mounting.
  • Typical IR less than 0.3 μA.
  • High surge current capability.
  • Low thermal resistance.
  • Solder Dip 260 °C, 40 seconds.
  • Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC.
  • This is a Pb.
  • Free Device.
  • All SMC Parts are Traceable to the Wafer Lot.
  • Additional testing can be offered upon request Mechanical Data:.
  • Case: GBPC, GBPC-W, Molded plastic.
  • Termin.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (GBPC50005-SangdestMicroelectronics.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number GBPC5010
Manufacturer Sangdest Microelectronics
File Size 362.04 KB
Description Single-Phase 50A Glass Passivated Bridge Rectifier
Datasheet download datasheet GBPC5010 Datasheet

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Other Datasheets by Sangdest Microelectronics

Part Number Description
GBPC5010W Single-Phase 50A Glass Passivated Bridge Rectifier
GBPC50005 Single-Phase 50A Glass Passivated Bridge Rectifier
GBPC50005W Single-Phase 50A Glass Passivated Bridge Rectifier
GBPC5001 Single-Phase 50A Glass Passivated Bridge Rectifier
GBPC5001W Single-Phase 50A Glass Passivated Bridge Rectifier

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
GBPC50005(W)-GBPC5010(W) Technical Data Data Sheet N1852, Rev. - GBPC50005(W)-GBPC5010(W) Green Products Single-Phase 50A Glass Passivated Bridge Rectifier Features:  Universal 3-way terminals: snap-on, wire wrap-around, or P.C.B. mounting  Typical IR less than 0.3 μA  High surge current capability  Low thermal resistance  Solder Dip 260 °C, 40 seconds  Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC  This is a Pb − Free Device  All SMC Parts are Traceable to the Wafer Lot  Additional testing can be offered upon request Mechanical Data:  Case: GBPC, GBPC-W, Molded plastic  Terminals: Nickel plated on faston lugs or Silver plated on wire leads, solderable per J-STD- 002B and JESD22-B102D. E4 suffix for commercial grade.
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