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MR18R1624GEG0 Datasheet, Samsung semiconductor

MR18R1624GEG0 parameters equivalent, key timing parameters.

MR18R1624GEG0 Avg. rating / M : 1.0 rating-11

datasheet Download (Size : 485.61KB)

MR18R1624GEG0 Datasheet
MR18R1624GEG0
Avg. rating / M : 1.0 rating-11

datasheet Download (Size : 485.61KB)

MR18R1624GEG0 Datasheet

Features and benefits


* High speed up to 1066 MHz RDRAM storage
* 184 edge connector pads with 1mm pad spacing
* Module PCB size : 133.35mm x 31.75mm x 1.27mm Form Factor The RIMM.

Application

including computer memory, personal computers, workstations and other applications where high bandwidth www.DataSheet4U..

Description

Signal Pins A1, A3, A5, A7, A9, A11, A13, A15, A17, A19, A21, A23, A25, A27, A29, A31, A33, A39, A52, A60, A62, A64, A66, A68, A70, A72, A74, A76, A78, A80, A82, A84, A86, A88, A90, A92, B1, B3, B5, B7, B9, B11, B13, B15, B17, B19, B21, B23, B25, B27.

Image gallery

MR18R1624GEG0 Page 1 MR18R1624GEG0 Page 2 MR18R1624GEG0 Page 3

TAGS

MR18R1624GEG0
Key
Timing
Parameters
Samsung semiconductor

Manufacturer


Samsung semiconductor

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