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MR16R1628GEG0 Datasheet

Manufacturer: Samsung Semiconductor
MR16R1628GEG0 datasheet preview

MR16R1628GEG0 Details

Part number MR16R1628GEG0
Datasheet MR16R1628GEG0 / MR18R1624GEG0 Datasheet PDF (Download)
File Size 485.61 KB
Manufacturer Samsung Semiconductor
Description Key Timing Parameters
MR16R1628GEG0 page 2 MR16R1628GEG0 page 3

MR16R1628GEG0 Overview

MR16R1624(8/G)EG0 MR18R1624(8/G)EG0 Change History Version 0.1 (December 2003) - Preliminary First copy. (July 2002) 256/288Mbit D-die RIMM Module Datasheet .. and low latency are required.

MR16R1628GEG0 Key Features

  • High speed up to 1066 MHz RDRAM storage
  • 184 edge connector pads with 1mm pad spacing
  • Module PCB size : 133.35mm x 31.75mm x 1.27mm
  • 256Mb and 288Mb base PC800 RIMM Module
  • Module PCB size : 133.35mm x 34.93mm x 1.27mm (5.25” x 1.375” x 0.05”)
  • 256Mb and 288Mb base PC1066 RIMM Module
  • Gold plated edge connector pad contacts
  • Serial Presence Detect(SPD) support
  • Operates from a 2.5 volt supply (±5%)
  • Powerdown self refresh modes

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