MR16R1628GEG0 Datasheet

Manufacturer: Samsung Semiconductor

This datasheet includes multiple variants, all published together in a single manufacturer document.

Datasheet Details

Part number	MR16R1628GEG0
Datasheet	MR16R1628GEG0 MR18R1624GEG0 Datasheet (PDF)
File Size	485.61 KB
Manufacturer	Samsung Semiconductor
Description	Key Timing Parameters

MR16R1628GEG0 Overview

MR16R1624(8/G)EG0 MR18R1624(8/G)EG0 Change History Version 0.1 (December 2003) - Preliminary First copy. (July 2002) 256/288Mbit D-die RIMM Module Datasheet .. and low latency are required.

MR16R1628GEG0 Key Features

High speed up to 1066 MHz RDRAM storage
184 edge connector pads with 1mm pad spacing
Module PCB size : 133.35mm x 31.75mm x 1.27mm
256Mb and 288Mb base PC800 RIMM Module
Module PCB size : 133.35mm x 34.93mm x 1.27mm (5.25” x 1.375” x 0.05”)
256Mb and 288Mb base PC1066 RIMM Module
Gold plated edge connector pad contacts
Serial Presence Detect(SPD) support
Operates from a 2.5 volt supply (±5%)
Powerdown self refresh modes

More Datasheets from Samsung Semiconductor

See all Samsung Semiconductor datasheets

Part Number	Description
MR16R1628AF0	(MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die
MR16R1628DF0	(MR1xR1622(4/8/G)DF0) Key Timing Parameters
MR16R1628DF0	(MR1xR1622(4/8/G)DF0) Key Timing Parameters
MR16R1622AF0	(MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die
MR16R1622DF0	(MR1xR1622(4/8/G)DF0) Key Timing Parameters
MR16R1624AF0	(MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die
MR16R1624DF0	(MR1xR1622(4/8/G)DF0) Key Timing Parameters
MR16R1624DF0	(MR1xR1622(4/8/G)DF0) Key Timing Parameters
MR16R1624GEG0	Key Timing Parameters
MR16R162GAF0	(MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die

Datasheet Details

MR16R1628GEG0 Overview

MR16R1628GEG0 Key Features

More Datasheets from Samsung Semiconductor

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