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MR16R1628GEG0 - Key Timing Parameters

This page provides the datasheet information for the MR16R1628GEG0, a member of the MR18R1624GEG0 Key Timing Parameters family.

Description

Signal Pins A1, A3, A5, A7, A9, A11, A13, A15, A17, A19, A21, A23, A25, A27, A29, A31, A33, A39, A52, A60, A62, A64, A66, A68, A70, A72, A74, A76, A78, A80, A82, A84, A86, A88, A90, A92, B1, B3, B5, B7, B9, B11, B13, B15, B17, B19, B21, B23, B25, B27, B29, B31, B33, B39, B52, B60, B62, B64, B66, B68

Features

  • High speed up to 1066 MHz RDRAM storage.
  • 184 edge connector pads with 1mm pad spacing.
  • Module PCB size : 133.35mm x 31.75mm x 1.27mm Form Factor The RIMM modules are offered in 184-pad 1mm edge connector pad pitch suitable for 184 contact RIMM connectors. Figure 1 below, shows a sixteen device RIMM module. (5.25” x 1.25” x 0.05”) - 256Mb and 288Mb base PC800 RIMM Module.
  • Module PCB size : 133.35mm x 34.93mm x 1.27mm (5.25” x 1.375” x 0.05”) - 256Mb and 288M.

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Datasheet Details

Part number MR16R1628GEG0
Manufacturer Samsung semiconductor
File Size 485.61 KB
Description Key Timing Parameters
Datasheet download datasheet MR16R1628GEG0 Datasheet
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Full PDF Text Transcription

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MR16R1624(8/G)EG0 MR18R1624(8/G)EG0 Change History Version 0.1 (December 2003) - Preliminary * First copy. * Based on the 1.0 ver. (July 2002) 256/288Mbit D-die RIMM Module Datasheet www.DataSheet4U.com Version 1.0 (May 2004) * Eliminate "Preliminary" Page 0 Version 1.0 May 2004 MR16R1624(8/G)EG0 MR18R1624(8/G)EG0 (16Mx16)*4(8/16)pcs RIMM Module based on 256Mb E-die, 32s banks,16K/32ms Ref, 2.5V (16Mx18)*4(8/16)pcs RIMM Module based on 288Mb E-die, 32s banks,16K/32ms Ref, 2.5V Overview The RIMM module is a general purpose high- performance memory module suitable for use in a broad range of applications including computer memory, personal computers, workstations and other applications where high bandwidth www.DataSheet4U.com and low latency are required.
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