K9K2G08U0A
description of Copy-back program is changed 4. TSOP package is deleted 1. CE access time : 23ns->35ns (p.9) 1. The value of t REA is changed. (18ns->20ns) 2. EDO mode is added. 1. The flow chart to creat the initial invalid block table is changed. 1. 1.8V FBGA spec is merged 2. 3.3V FBGA package is added 3. FBGA package size is changed to 9.5 x 12 4. Leaded part is deleted
Draft Date
May. 31. 2004 Oct. 25. 2004
Remark
Advance Preliminary
0.2 0.3 0.4 1.0
Feb. 14. 2005 May May 4 2005 6 2005
Feb. 1 2006
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have any questions, please contact the SAMSUNG branch office near your office.
K9K2G08U0A K9K2G08R0A 256M x 8 Bit NAND Flash Memory
PRODUCT LIST
Part Number K9K2G08U0A-F K9K2G08X0A-J Vcc Range 2.7 ~ 3.6V 1.65 ~ 1.95V Organization X8...
