M474B1G73QH0 datasheet, q-die equivalent, Samsung

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datasheet Download (Size : 478.00KB)

Features and benefits

4 3. Address Configuration ......4 4. x64 DIMM Pin Configurations (Front side/Back Side).........5 5. x72 DIMM Pin Configurations (Front side/Back Side).........6 6. Pin .

Application

where product failure could result in loss of life or personal or physical harm, or any military or defense application,.

Description

.......7 7. SPD and Thermal Sensor for ECC SODIMMs7 8. Input/Output Functional Description......8 9. Function Block Diagram: ...10 9.1 2GB, 256Mx64 Module (Populated as 1 rank of x16 DDR3 SDRAMs) ....... 10 9.2 4GB, 512Mx64 Module (Populated as 1 ran.

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