900,000+ datasheet pdf search and download

Datasheet4U offers most rated semiconductors data sheet pdf




  Samsung Electronic Components Datasheet  

KLM4G1FE3B-B001 Datasheet

e.MMC

No Preview Available !

Rev. 1.0, Oct. 2011
KLMxGxFE3B-x00x
Samsung e·MMC Product family
e.MMC 4.41 Specification compatibility
datasheet
SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND
SPECIFICATIONS WITHOUT NOTICE.
Products and specifications discussed herein are for reference purposes only. All information discussed
herein is provided on an "AS IS" basis, without warranties of any kind.
This document and all information discussed herein remain the sole and exclusive property of Samsung
Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property
right is granted by one party to the other party under this document, by implication, estoppel or other-
wise.
Samsung products are not intended for use in life support, critical care, medical, safety equipment, or
similar applications where product failure could result in loss of life or personal or physical harm, or any
military or defense application, or any governmental procurement to which special terms or provisions
may apply.
For updates or additional information about Samsung products, contact your nearest Samsung office.
All brand names, trademarks and registered trademarks belong to their respective owners.
2011 Samsung Electronics Co., Ltd. All rights reserved.
-1-


  Samsung Electronic Components Datasheet  

KLM4G1FE3B-B001 Datasheet

e.MMC

No Preview Available !

KLMxGxFE3B-x00x
datasheet
Rev. 1.0
e·MMC
Revision History
Revision No.
0.0
0.1
0.5
1.0
History
1. Initial issue
1. User Density Ratio & Part No. of 4GB are changed in Chapter1.0
2. Package Dimension(11.5mm x 13mm x 1.0mm ) Typo is corrected.
3. Max. size of Boot Partition 1,2 and RPMB is changed in Table 28.
4. Typ. Standby Current of NAND is changed to 15uA per chip in Chapter 8.2
1. Engineering Sample
2. SEC_COUNT and MAX_ENH_SIZE_MULT are changed in Chapter 6.4
3. Max. Write Timeout is changed in Chapter 7.1
4. Wakeup Time from Sleep Mode is added in Chapter 5.1.6
5. Remarks of Init, Runtime bad block and remain reserved block per bank in
Smart Report Output data are changed in Chapter 5.2.2
1. Typo of Product Name Table is changed in Chapter 6.2.1
2. Performance is updated with measured value in Chapter 5.2.3
3. Read Latency after High Priority Interrupt and Typ. Value of Time Parameter
are deleted in Chapter 7.1
4. Wakeup Time from APS Mode and Sleep Mode is deleted in Table 26
5. User Density(%) of 4GB is modified in Chapter 1.0
Draft Date
Jun. 01, 2011
Aug. 05, 2011
Sep. 01, 2011
Oct. 12, 2011
Remark
Target
Target
Preliminary
Final
Editor
S.M.Lee
S.M.Lee
S.M.Lee
S.M.Lee
-2-


Part Number KLM4G1FE3B-B001
Description e.MMC
Maker Samsung
Total Page 30 Pages
PDF Download

KLM4G1FE3B-B001 Datasheet PDF

View PDF for Mobile








Similar Datasheet

1 KLM4G1FE3B-B001 e.MMC
Samsung





Part Number Start With

0    1    2    3    4    5    6    7    8    9    A    B    C    D    E    F    G    H    I    J    K    L    M    N    O    P    Q    R    S    T    U    V    W    X    Y    Z

Site map

Webmaste! click here

Contact us

Buy Components

Privacy Policy