• Part: CIS21J121
  • Description: Chip Bead
  • Manufacturer: Samsung Semiconductor
  • Size: 287.14 KB
Download CIS21J121 Datasheet PDF
Samsung Semiconductor
CIS21J121
CIS21J121 is Chip Bead manufactured by Samsung Semiconductor.
Feature The smallest beads used for high current. (CIC: ~3A, CIS: ~6A) Application Suppression of noise in power line The CIC/CIS Series can be used in high current owing to their low DC resistance. They can match power lines to a maximum of 6A DC. Operating Temp Storage Temp -55~+125 -10~+40 Dimensions Ferrite Body External Electrode d t SIZE CODE 05 10 21 31 32 41 1.0 0.05 1.6 0.15 2.0 0.2 3.2 0.2 3.2 0.2 4.5 0.2 0.5 0.05 0.8 0.15 1.25 0.2 1.6 0.2 2.5 0.2 1.6 0.2 W t 0.5 0.05 0.8 0.15/0.6 0.15 0.9 0.2 1.1 0.2 1.3 0.2 1.6 0.2 / 1.2 0.2 Unit : mm d 0.25 0.1 0.3 0.2 0.5 0.2,-0.3 0.5 0.2,-0.3 0.5 0.3 0.5 0.3 Part Numbering CI C 05 P 300 N C (1) (2) (3) (4) (5) (6) (7) (1) Chip Beads (2) C: For high current ~3A, S: Ultra high current ~6A (3) Dimension (4) Material Code(J, P) (5) Nominal impedance(310: 31 , 121: 120 ) (6) Thickness option(N: Standard, A: Thinner than standard, B: Thicker than standard) (7) Packaging(C:...