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CIM10N241

Manufacturer: Samsung Semiconductor

CIM10N241 datasheet by Samsung Semiconductor.

This datasheet includes multiple variants, all published together in a single manufacturer document.

CIM10N241 datasheet preview

CIM10N241 Datasheet Details

Part number CIM10N241
Datasheet CIM10N241 CIB Datasheet (PDF)
File Size 750.18 KB
Manufacturer Samsung Semiconductor
Description Chip Bead
CIM10N241 page 2 CIM10N241 page 3

CIM10N241 Overview

Multi-layer type B:Mono-layer type (3) Dimension (4) Material Code (5) Nominal impedance (121:120Ω, 202:2000Ω ) (6) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard) (7) Packaging(C:paper tape, E:embossed tape) REMENDED SOLDERING CONDITION REFLOW SOLDERING FLOW SOLDERING PACKAGING Packaging Style Card Board Taping Quantity(pcs/reel) 4000 NOTICE :All specifications are subject to change...

CIM10N241 Key Features

  • Perfect shape for automatic mounting, with no directionality
  • Excellent solderability and high heat resistance for either flow or
  • Monolithic inorganic material construction for high reliability
  • Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs
  • NOTICE :All specifications are subject to change without previous notice. Please contact with product representatives or
Samsung Semiconductor logo - Manufacturer

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