CIM10J751 - Chip Bead

This page provides the datasheet information for the CIM10J751, a member of the CIB Chip Bead family.

Datasheet Summary

Description

Part no.

Features

Perfect shape for automatic mounting, with no directionality.
Excellent solderability and high heat resistance for either flow or reflow soldering.
Monolithic inorganic material construction for high reliability.
Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs.

Samsung

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Datasheet Details

Part number	CIM10J751
Manufacturer	Samsung
File Size	750.18 KB
Description	Chip Bead
Datasheet	CIM10J751 Datasheet
Additional preview pages of the CIM10J751 datasheet.

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Full PDF Text Transcription

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Chip Bead For EMI Suppression 201208 CIB/CIM10 Series (1608/ EIA 0603) APPLICATION High frequency EMI prevention application to computers, printers, VCRs, TVs and mobile phones. FEATURES  Perfect shape for automatic mounting, with no directionality.  Excellent solderability and high heat resistance for either flow or reflow soldering  Monolithic inorganic material construction for high reliability  Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs. DIMENSION RECOMMENDED LAND PATTERN 0.6~0.8mm 0.6~0.8mm 0.6~0.8mm 0.6~0.8mm Type Dimension [mm] LW t d 10 1.6±0.15 0.8±0.15 0.8±0.15 0.3±0.2 DESCRIPTION Part no.

Published: Dec 2, 2014 |