• Part: CIM10J470
  • Description: Chip Bead
  • Manufacturer: Samsung Semiconductor
  • Size: 750.18 KB
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CIM10J470 Key Features

  • Perfect shape for automatic mounting, with no directionality
  • Excellent solderability and high heat resistance for either flow or
  • Monolithic inorganic material construction for high reliability
  • Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs
  • NOTICE :All specifications are subject to change without previous notice. Please contact with product representatives or

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