CIM10J470 - Chip Bead

Download the CIM10J470 datasheet PDF (CIB included). The manufacturer datasheet provides complete specifications, pinout details, electrical characteristics, and typical applications for chip bead.

Description

Part no.

Features

Perfect shape for automatic mounting, with no directionality.
Excellent solderability and high heat resistance for either flow or reflow soldering.
Monolithic inorganic material construction for high reliability.
Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs.

Samsung Semiconductor

📥 Download Datasheet

CIM10J470 chip bead by Samsung - Datasheet Preview — Note: The manufacturer provides a single datasheet file (CIB-10P100.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number	CIM10J470
Manufacturer	Samsung Semiconductor
File Size	750.18 KB
Description	Chip Bead
Datasheet	CIM10J470 Datasheet

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Full PDF Text Transcription

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Chip Bead For EMI Suppression 201208 CIB/CIM10 Series (1608/ EIA 0603) APPLICATION High frequency EMI prevention application to computers, printers, VCRs, TVs and mobile phones. FEATURES  Perfect shape for automatic mounting, with no directionality.  Excellent solderability and high heat resistance for either flow or reflow soldering  Monolithic inorganic material construction for high reliability  Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs. DIMENSION RECOMMENDED LAND PATTERN 0.6~0.8mm 0.6~0.8mm 0.6~0.8mm 0.6~0.8mm Type Dimension [mm] LW t d 10 1.6±0.15 0.8±0.15 0.8±0.15 0.3±0.2 DESCRIPTION Part no.

Published: Dec 2, 2014 |