CIM10J400 Datasheet | Samsung Semiconductor

FEATURES - Perfect shape for automatic mounting, with no directionality. - Excellent solderability and high heat resistance for either flow or reflow soldering - Monolithic inorganic material construction for high reliability - Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs. DIMENSION REMENDED LAND PATTERN 0.6~0.8mm 0.6~0.8mm 0.6~0.8mm 0.6~0.8mm Type Dimension [mm] LW t d 10 1.6±0.15 0.8±0.15 0.8±0.15 0.3±0.2 DESCRIPTION Part no. CIB10P100 CIB10P220 CIB10P260 CIB10P300 CIB10P330 CIM10U800 CIM10U121 CIM10U221 CIM10U241 CIM10U301 CIM10U471 CIM10U601 CIM10U102 CIM10U202 CIB10J300 CIM10J400 CIM10J470 CIM10J600 CIM10J750 CIM10J800 CIM10J121 CIM10J151 CIM10J221 CIM10J241 Thickness (mm) 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 Impedance (Ω)±25%@100MHz 10 22 26 30 33...