Datasheet4U Logo Datasheet4U.com
Samsung Semiconductor logo

CIM10J241 Datasheet

Manufacturer: Samsung Semiconductor

This datasheet includes multiple variants, all published together in a single manufacturer document.

CIM10J241 datasheet preview

Datasheet Details

Part number CIM10J241
Datasheet CIM10J241 CIB Datasheet (PDF)
File Size 750.18 KB
Manufacturer Samsung Semiconductor
Description Chip Bead
CIM10J241 page 2 CIM10J241 page 3

CIM10J241 Overview

Multi-layer type B:Mono-layer type (3) Dimension (4) Material Code (5) Nominal impedance (121:120Ω, 202:2000Ω ) (6) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard) (7) Packaging(C:paper tape, E:embossed tape) REMENDED SOLDERING CONDITION REFLOW SOLDERING FLOW SOLDERING PACKAGING Packaging Style Card Board Taping Quantity(pcs/reel) 4000 NOTICE :All specifications are subject to change...

CIM10J241 Key Features

  • Perfect shape for automatic mounting, with no directionality
  • Excellent solderability and high heat resistance for either flow or
  • Monolithic inorganic material construction for high reliability
  • Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs
  • NOTICE :All specifications are subject to change without previous notice. Please contact with product representatives or
Samsung Semiconductor logo - Manufacturer

More Datasheets from Samsung Semiconductor

See all Samsung Semiconductor datasheets

Part Number Description
CIM10J241 Chip Bead
CIM10J221 Chip Bead
CIM10J252 Chip Bead
CIM10J102 Chip Bead
CIM10J102 Chip Bead
CIM10J121 Chip Bead
CIM10J121 Chip Bead
CIM10J151 Chip Bead
CIM10J151 Chip Bead
CIM10J152 Chip Bead

CIM10J241 Distributor

Datasheet4U Logo
Since 2006. D4U Semicon. About Datasheet4U Contact Us Privacy Policy Purchase of parts