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CIM10J241 Datasheet Chip Bead

Manufacturer: Samsung Semiconductor

Overview: Chip Bead For EMI Suppression 201208 CIB/CIM10 Series (1608/ EIA 0603) APPLICATION High frequency EMI prevention application to computers, printers, VCRs, TVs and mobile phones.

This datasheet includes multiple variants, all published together in a single manufacturer document.

General Description

Part no.

CIB10P100 CIB10P220 CIB10P260 CIB10P300 CIB10P330 CIM10U800 CIM10U121 CIM10U221 CIM10U241 CIM10U301 CIM10U471 CIM10U601 CIM10U102 CIM10U202 CIB10J300 CIM10J400 CIM10J470 CIM10J600 CIM10J750 CIM10J800 CIM10J121 CIM10J151 CIM10J221 CIM10J241 Thickness (mm) 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 0.8±0.15 Impedance (Ω)±25%@100MHz 10 22 26 30 33 80 120 220 240 300 470 600 1000 2000(at 70MHz) 30 40 47 60 75 80 120 150 220 240 DC Resistance (Ω) Max.

0.05 0.05 0.08 0.08 0.08 0.10 0.15 0.25 0.25 0.30 0.35 0.38 0.50 1.20 0.10 0.12 0.12 0.12 0.15 0.15 0.20 0.20 0.30 0.30 Rated Current (mA) Max.

Key Features

  • Perfect shape for automatic mounting, with no directionality.
  • Excellent solderability and high heat resistance for either flow or reflow soldering.
  • Monolithic inorganic material construction for high reliability.
  • Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs.

More Datasheets from Samsung Semiconductor

Part Number Description
CIM10J241 Chip Bead
CIM10J221 Chip Bead
CIM10J252 Chip Bead
CIM10J102 Chip Bead
CIM10J102 Chip Bead
CIM10J121 Chip Bead
CIM10J121 Chip Bead
CIM10J151 Chip Bead
CIM10J151 Chip Bead
CIM10J152 Chip Bead

CIM10J241 Distributor