Part CIM05U300
Description Chip Bead
Manufacturer Samsung Semiconductor
Size 1.05 MB
Samsung Semiconductor

CIM05U300 Overview

Key Features

  • Smallest beads suitable for surface mounting Perfect shape for automatic mounting, with no directionality
  • Excellent solderability and high heat resistance for either flow or reflow soldering
  • Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs