• Part: CIM05U300
  • Description: Chip Bead
  • Manufacturer: Samsung Semiconductor
  • Size: 1.05 MB
Download CIM05U300 Datasheet PDF
Samsung Semiconductor
CIM05U300
Feature Smallest beads suitable for surface mounting Perfect shape for automatic mounting, with no directionality. Excellent solderability and high heat resistance for either flow or reflow soldering. Monolithic inorganic material construction for high reliability. Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs. Application High frequency EMI prevention application to puters, printers, VCRs, TVs and mobile phones. The CIB/CIM Series are used for EMI suppression filter. These beads suppress electro-magnetic wave noise by increased impedance, especially by increased resistance at noise frequency. CIB Series The CIB Series is posed of mono-layer internal conductor that allows low impedance and low DC resistance. CIM Series The CIM Series display high impedance because it is posed of a multilayered internal conductor and has excellent attenuation characteristics for wide band frequencies. Operating Temp Storage Temp -55~+125...