SP07N65
FEATURES
Super high dense cell design for low RDS(ON). Rugged and reliable. Suface Mount Package.
PIN 1
56 78
DFN 5x6
12 34
ABSOLUTE MAXIMUM RATINGS (TA=25°C unless otherwise noted)
Symbol Parameter
VDS Drain-Source Voltage
VGS Gate-Source Voltage
Drain Current-Continuous a c
TA=25°C TA=70°C
IDM -Pulsed c
Maximum Power Dissipation a
TA=25°C TA=70°C
TJ, TSTG
Operating Junction and Storage Temperature Range
THERMAL CHARACTERISTICS
R JA
Thermal Resistance, Junction-to-Ambient
Limit 650 ±20 1 0.8 3.5 3.1 2
-55 to 150
Units V V A A A W W
°C
°C/W
Details are subject to change without notice.
May,26,2014
.samhop..tw
Ver 1.0
ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted)
Symbol Parameter
Conditions
Min
OFF CHARACTERISTICS BVDSS Drain-Source Breakdown Voltage IDSS Zero Gate Voltage Drain Current IGSS Gate-Body Leakage Current
ON CHARACTERISTICS
VGS(th)...
