Order code SH32N65DM6AG VDS 650 V RDS(on) max. 97 mΩ ID 32 A
* AQG 324 qualified
* Half-bridge power module
* 650 V blocking voltage
* Fast recovery b.

* Switching applications Description This device combines two MOSFETs in a half-bridge topology. The ACEPACK SMIT is.

This device combines two MOSFETs in a half-bridge topology. The ACEPACK SMIT is a very compact and rugged power module in a surface mount package for easy assembly. Thanks to the DBC substrate, the ACEPACK SMIT package offers low thermal resistance c.

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