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STMicroelectronics Electronic Components Datasheet

PLCC20 Datasheet

PLCC 20

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® Thermal Data
PLCC 20
20 leads
PACKAGE MATERIAL LIST
item #
leadframe
die attach
molding
compound
material
copper
epoxy glue
( silver filler )
epoxy resin
thickness
0.25 mm
10-40 µm
thermal
conductivity
2.61 W/cm°C
0.01 W/cm°C
3.6 mm
0.0063W/cm°C
Charts enclosed :
1) Rth(j-a) vs power dissipation
2) Rth(j-a) vs on board trace area
3) Zth(j-a) vs time width and die size
February 1998
1/2


STMicroelectronics Electronic Components Datasheet

PLCC20 Datasheet

PLCC 20

No Preview Available !

Thermal Data
PLCC 20
1)
2)
3)
2/2
Rth(j-a) (ºC/W)
180
160
die pad = 140 x 140 sq.mils
die size = 80 x 120 sq.mils
140
floating in air
120
100
mounted on SM PCB5A board
80 mounted on SM PCB5 board
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
dissipated power ( Watt )
Rth(j-a) (ºC/W)
105
100
95
die size = 80 x 120 sq.mils
die pad = 140 x 140 sq.mils
Pd =1 W
90
85
80
75
70
0
50 100 150 200 250 300 350
on board trace area ( x 1000 sq. mils )
Transient Thermal Resistance (ºC/W)
100
SINGLE PULSE
50
mounted on SM PCB5 board
Pd = 2 Watt
20
10
5
die pad = 140 x 140 sq.mils
die size = 80 x 120 sq.mils
on die dissipating area = 2000 sq.mils
2
1
0.001
0.01
0.1 1
10
Time or pulse width ( s )
100 1,000


Part Number PLCC20
Description PLCC 20
Maker ST Microelectronics
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PLCC20 Datasheet PDF






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