Datasheet Summary
®
Thermal Data
PLCC 20
20 leads
PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.61 W/cm°C 0.01 W/cm°C leadframe die attach copper epoxy glue ( silver filler ) epoxy resin
0.25 mm 10-40 µm molding pound
3.6 mm
0.0063W/cm°C
Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Rth(j-a) vs on board trace area 3) Zth(j-a) vs time width and die size
February 1998
1/2
Thermal Data
Rth(j-a) (ºC/W) 180 die pad = 140 x 140 sq.mils die size = 80 x 120 sq.mils
PLCC 20
140 floating in air
1)
120 100 mounted on SM PCB5A board
80 mounted on SM PCB5 board
0.8 1 1.2 dissipated power ( Watt )
Rth(j-a) (ºC/W) 105 die size...
