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®
Thermal Data
PLCC 20
20 leads
PACKAGE MATERIAL LIST
item # material thickness thermal conductivity 2.61 W/cm°C 0.01 W/cm°C
leadframe die attach
copper epoxy glue ( silver filler ) epoxy resin
0.25 mm 10-40 µm
molding compound
3.6 mm
0.0063W/cm°C
Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Rth(j-a) vs on board trace area 3) Zth(j-a) vs time width and die size
February 1998
1/2
Thermal Data
Rth(j-a) (ºC/W) 180
die pad = 140 x 140 sq.mils die size = 80 x 120 sq.mils
PLCC 20
160
140
floating in air
1)
120 100
mounted on SM PCB5A board
80
mounted on SM PCB5 board
0
0.2
0.4
0.6
0.8 1 1.2 dissipated power ( Watt )
1.4
1.6
1.8
2
Rth(j-a) (ºC/W) 105
die size = 80 x 120 sq.mils die pad = 140 x 140 sq.
PLCC20 Datasheet
