MLPF-WB55-02E3 Datasheet | STMicroelectronics

Features - Integrated impedance matching to STM32WB55Vx - LGA footprint patible - 50 Ω nominal impedance on antenna side - Deep rejection harmonics filter - Low insertion loss - Small footprint - Low thickness ≤ 450 μm - High RF performance - RF BOM and area reduction - ECOPACK2 pliant ponent Applications - Bluetooth 5 - Open Thread - Zigbee® - IEEE 802.15.4 - Optimized for STM32WB55Vx Description The MLPF-WB55-02E3 integrates an impedance matching network and harmonics filter. The matching impedance network has been tailored to maximize the RF performance of STM32WB55Vx. This device uses STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF performance. DS13176 - Rev 3 - November 2022 For further information contact your local STMicroelectronics sales office. .st. Characteristics Characteristics Symbol PIN VESD Table 1. Absolute ratings (Tamb = 25 °C) Parameter Input power RFIN ESD ratings human body model (JESD22-A114-C), all I/O one at a time while others connected to GND ESD ratings machine model, all I/O Maximum operating temperature Value 10 2000 200 -40 to +105 Unit d Bm °C Table 2. Impedances(Tamb = 25 °C) Symbol Parameter ZIN...