HSP053-4M5 Key Features
- Very pact 500 µm pitch package, for easy PCB layout
- Very-large bandwidth: 11.5 GHz (HSP051-4M5), 18 GHz (HSP053-4M5)
- Very-low capacitance: 0.35 pF (HSP051-4M5
- I/O to GND), 0.25 pF
- I/O to GND)
- Low leakage current: < 1 nA
- High integration
- Suitable for high density boards
- Extended operating junction temperature range : -40 °C to 150 °C
- Exceeds IEC 61400-4-2 level standard