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EMIF07-LCD02F3 - EMI filter and ESD protection

General Description

The EMIF07-LCD02F3 is a 7-line highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference.

The EMIF07 Flip Chip packaging means the package size is equal to the die size.

Key Features

  • EMI symmetrical (I/O) low-pass filter High efficiency in EMI filtering Lead-free package Very low PCB space occupation: 1.42 mm x 1.42 mm Very thin package: 0.65 mm High efficiency in ESD suppression High reliability offered by monolithic integration High reduction of parasitic elements through integration and wafer level packaging Figure 1. 5 O1 Flip Chip (18 bumps) Pin layout (bump side) 4 O2 3 GND 2 I1 1 I2 I3 Complies with the following.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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www.DataSheet4U.com EMIF07-LCD02F3 7-line IPAD™, EMI filter and ESD protection for LCD and cameras Features ■ ■ ■ ■ ■ ■ ■ ■ EMI symmetrical (I/O) low-pass filter High efficiency in EMI filtering Lead-free package Very low PCB space occupation: 1.42 mm x 1.42 mm Very thin package: 0.65 mm High efficiency in ESD suppression High reliability offered by monolithic integration High reduction of parasitic elements through integration and wafer level packaging Figure 1.