EMIF02-MIC02F2 Overview
The EMIF02-MIC02 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF02 Flip-Chip packaging means the package size is equal to the die size. This filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up 15 kV.
EMIF02-MIC02F2 Key Features
- EMI symmetrical (I/O) low-pass filter
- High efficiency in EMI filtering t(s
- Lead-free package c
- Very low PCB space occupation: u 1.42 mm x 0.92 mm rod
- Very thin package: 0.65 mm P
- High efficiency in ESD suppression te
- High reliability offered by monolithic integration le
- High reducing of parasitic elements through o integration and wafer level packaging bs plies with the following standard
- IEC 61000-4-2 level 4 on input pins )
- 15 kV (air discharge) t(s