EMIF02-MIC02F2
Overview
The EMIF02-MIC02 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF02 Flip-Chip packaging means the package size is equal to the die size.
- EMI symmetrical (I/O) low-pass filter )
- High efficiency in EMI filtering t(s
- Lead-free package c
- Very low PCB space occupation: u 1.42 mm x 0.92 mm rod
- Very thin package: 0.65 mm P
- High efficiency in ESD suppression te
- High reliability offered by monolithic integration le
- High reducing of parasitic elements through o integration and wafer level packaging bs Complies with the following standards - O
- IEC 61000-4-2 level 4 on input pins ) - 15 kV (air discharge) t(s - 8 kV (contact discharge) uc
- IEC 61000-4-2 level 1 on input pins d - 2 kV (air discharge) ro - 2 kV (contact discharge) te P Applications le Where EMI filtering in ESD sensitive equipment is so required: Ob
