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D10, D15, D20, D22, C20, C30 MICROMODULES
Memory Micromodules General Information for D1, D2 and C Packaging
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Micromodules were developed specifically for embedding in Smartcards and Memory Cards The Micromodule provides: – Support for the chip – Electrical contacts – Suitable embedding interface for gluing the module to the plastic package
potting side
contact side
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D15
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Physical dimensions and contact positions compliant to the ISO 7816 standard Micromodules delivered as a continuous Super 35 mm tape. (This differs from the standard 35 mm tape in the spacing distance between the indexing holes.)
D10 D20
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DESCRIPTION Memory Cards consist of two main parts: the plastic card, and the embedded Micromodule (which, in turn, carries the silicon chip).